Product Features
Excellent thermal conductivity and low viscosity.
Good fluidity and rapid bubble removal.
Cures at room temperature, and heating can accelerate the curing speed.
Moisture-proof and shock-resistant, with no corrosion to the base material.
Typical Applications:
High-frequency electronic components such as power modules, inverters, and ballasts.
Electronic control units and sensors.
LED lighting components, as well as other suitable encapsulation applications in the industrial field.
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